Heat dissipation of the motor-Line

Due to the presence of wiring and components, the heat dissipation of double-layer PCBs may be more difficult. Therefore, it is necessary to provide as many solid copper surfaces as possible and achieve good thermal connection with the motor driver IC. Adding copper clad areas on both outer layers and connecting them with many through holes helps to dissipate heat between the areas divided by wiring and components.

Line width: wider is better

Due to the high input and output current of the motor driver IC (exceeding 10 A in some cases), careful consideration should be given to the PCB wiring width of the input and output devices. The wider the wiring, the lower the resistance. It is necessary to adjust the wiring size to ensure that the wiring resistance does not consume excessive power and avoid causing the wiring to heat up. A wire that is too small can actually be used as an electric fuse and is easy to burn!

Designers typically use the IPC-2221 standard to determine the appropriate wiring width. This specification provides corresponding charts showing the cross-sectional area of copper for various current levels and allowable temperature rise, which can be converted into the wiring width under a given copper layer thickness condition. For example, the wiring carrying 10 A current in a 1 ounce copper layer needs to be slightly wider than 7 mm to achieve a temperature rise of 10 ℃. For 1-A current, the wiring width only needs to be 0.3 mm.

Given this, it seems impossible for a 10 A current to pass through a micro IC board.

It should be understood that the recommended wiring width in IPC-2221 is suitable for equal width and long distance PCB wiring. If shorter PCB wiring is used, it is also possible to pass much larger currents without any adverse effects. This is because short and narrow PCBs have lower wiring resistance, and any heat generated will be absorbed into a wider copper area, which acts as a heat sink.

Widening PCB wiring,

To enable the IC board to better handle continuous current.

Any heat generated by the narrower part of the wiring is transmitted to the wider copper area, so that the temperature rise of the narrower wiring can be ignored.

The wiring embedded in the inner layer of a PCB cannot fully dissipate heat like the wiring on the outer layer, because the insulation substrate has poor thermal conductivity. For this reason, the inner wiring should be designed to be about twice the width of the outer wiring.

If space permits, using wider wiring or copper clad areas for wiring can minimize temperature rise and voltage drop.

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